Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces

Lorena Marín (1) , Charith E. Nanayakkara (2) , Jean-Francois Veyan (2) , Bénédicte Warot-Fonrose (3) , Sébastien Joulié (3) , Alain Estève (1) , Christophe Tenailleau (4) , Yves J. Chabal (2) , Carole Rossi (1)

1 LAAS-N2IS - Équipe Nano Ingénierie et Intégration des Systèmes
2 UT Dallas - University of Texas at Dallas [Richardson]
3 CEMES - Centre d'élaboration de matériaux et d'études structurales
4 CIRIMAT - Centre interuniversitaire de recherche et d'ingenierie des matériaux

In situ deposition of a thin (∼5 nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.

Mots clés: Nanothermite; CuO; Al; Cu; Cu enriched multilayers; Intermixing; Nanoenergetic materials

Domaines: Matériaux; Electromagnétisme

Lorena Marín, Charith E. Nanayakkara, Jean-Francois Veyan, Bénédicte Warot-Fonrose, Sébastien Joulié, et al.. Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces. ACS Applied Materials & Interfaces, 2015, vol. 7 (n° 22), pp. 11713-11718. ⟨10.1021/acsami.5b02653⟩. ⟨hal-01452182⟩